SAN DIEGO, June 26, 2016 /PRNewswire/ — Qualcomm Incorporated (NASDAQ: QCOM) today announced that its subsidiary, Qualcomm Technologies, Inc., has secured more than 100 design wins across more than 60 original equipment manufacturers (OEMs) and module OEMs based on its MDM9x07 chipset family comprised of the Qualcomm® Snapdragon™ X5 LTE (9×07) modem and MDM9207-1 modem for the Internet of Things (IoT). The flexible chipset family offers security-focused and optimized cellular connectivity, as well as edge processing for a large array of devices and systems within the IoT. These modems are designed to address customer connectivity and power challenges in a wide range of use cases including in smart cities, commercial applications and industrial designs. These uses include smart energy & metering, building security, infrastructure, industrial control and automation, retail point of sale, asset tracking, medical, lighting and aftermarket telematics.
The Snapdragon X5 LTE modem (9×07) with All Mode capability, supports LTE Category 4 download speeds up to 150 Mbps. The MDM9207-1 modem offers LTE Category 1 support for up to 10 Mbps on the downlink, power save mode (PSM) and up to 10 years of battery life from two AA batteries. These modems are designed to be compatible with major cellular standards across the globe, and include Linux OS support, ARM Cortex A7 processor, pre-integrated support for Qualcomm® VIVE™ 802.11ac Wi-Fi with MU-MIMO technology, Bluetooth 4.2, Bluetooth Low Energy, and integrated GNSS. Engineered to offer design simplicity, this chipset supports scalable software reuse across the chipset platform in order to reduce design complexity, ease development costs and enable faster time to commercialization.
The rapid growth of the IoT is driving a massive new ecosystem of smart, cellular connected machines and things, and with that a wide range of connectivity requirements. Qualcomm Technologies is helping to evolve LTE to deliver a unified, scalable IoT platform. Beyond wide-area coverage, cellular networks deliver numerous benefits to IoT applications including ubiquitous coverage, scalability to address the wide range of IoT use cases, managed and predictable quality of service, high reliability, robust end-to-end security, seamless interoperability backed by global standards and coexistence with deployed and planned LTE infrastructure.
“Our LTE modems for IoT allow us to bring customers the power and flexibility of the same modem core technology already launched in hundreds of millions of devices globally so that they can address a broad range of commercial and industrial applications where wide area cellular connectivity adds a tremendous benefit,” said Serge Willenegger, senior vice president, product management of Qualcomm Technologies, Inc. “Our momentum demonstrates the widespread acceptance of our LTE IoT solutions in many fast growing IoT areas, as we help make industries around the world more connected, efficient and sustainable than ever before.”
“Qualcomm Technologies has a long history of leadership in connectivity and we are thrilled to be able to use their expertise in LTE for the IoT space,” said Mr. Vincent Wang, CEO at NEOWAY. “With their LTE IoT modems, Qualcomm Technologies is enabling our solutions to be the most advanced and helping drive the ecosystem of smart, connected devices forward.”
“As a dedicated M2M/IoT wireless module supplier, we are always looking for new ways to innovate and accelerate growth,” said Delbert Sun, marketing director of Quectel. “With Qualcomm Technologies, we see a great opportunity to make our IoT and mobile broadband modules more cost efficient by minimizing our up-front capital expenditures thus allowing Quectel to continue to focus its resources on quality and performance.”
“We have a long and close relationship with Qualcomm Technologies, and our next-generation series of AirPrime® Smart modules will reflect that storied history,” said Dan Schieler, SVP & GM, OEM Solutions, Sierra Wireless. “Using Qualcomm Technologies IoT modems will make it easier for us to develop smart modules with integrated processing capabilities and help our customers reduce their overall system complexity and get to market faster.”
“Thanks to the incredible growth in the Internet of Things, every facet of our world is becoming connected,” said Wendy Wang, general manager, Simcom. “We’re collaborating with Qualcomm Technologies to quickly and seamlessly build 3G/4G LTE modules for smart meters capable of remote monitoring and management of water, gas, heat and electricity, which in turn will enable time management efficiencies and a reduction in cost for utilities companies.”
“Telit has leveraged the power and flexibility of the Qualcomm MDM9x07 chipset and its variants across broad IoT markets. We have been able to address MNO requirements quickly and across many geographies with products ranging from LTE Cat 1 to Cat 4 today, with a path to 3GPP Rel13 MTC technologies like LTE Cat M1 and LTE Cat NB-1 for the future, both in single-mode and multimode variants,” said Ronen Ben-Hamou, EVP of products and solutions, Telit. “Qualcomm Technologies chipsets share a large number of common software elements which assures Telit’s trademark application software cross-compatibility among our IoT Modules, so that our customers can easily re-use applications and launch new products into different markets.”
“We expect billions of devices to become connected in the coming years, but it’s only achievable if we can produce these devices faster and at lower costs,” said Fayu Chen, senior vice president of Automotive & Digital Media BU, WNC. “We are already hard at work designing products that utilize Qualcomm Technologies’ LTE IoT modems.”
“ZTE and Qualcomm Technologies have collaborated together for many years, and we’re pleased to have the opportunity to do so again with their LTE IoT modems,” said Gu Yongcheng, vice president of ZTE corporation and CEO of ZTE Welink. “As we continue to implement connectivity solutions for the IoT and M2M applications, the new chipset platform makes it possible to provide more cost-effective devices with a shorter time-to-launch.”
Qualcomm Technologies is also continuing to expand the capabilities of LTE to accelerate progress in IoT, including driving the new LTE IoT technologies with Release 13 of the 3GPP standard towards commercialization, as well as the evolution of the cellular ecosystem towards 5G which will bring even more opportunities for the IoT. The MDM9206 modem, featuring a purpose-built IoT design and offering even lower power consumption and longer range supports LTE eMTC (Category M1) and NB-IoT (Category NB-1) modes.
Commercial IoT devices based on the Snapdragon X5 (9×07) and MDM9207-1 LTE modems are available today with others expected to continue shipping. Module OEMs are expected to launch MDM9206-based Cat M1 capable modules in early 2017. A software upgrade for Cat NB-1 is expected to be available shortly thereafter.
The benefits and capabilities of Qualcomm Technologies’ LTE modems for IoT will be demonstrated at the Qualcomm booth (#N2.338 in Hall N1) at the upcoming Mobile World Congress Shanghai event taking place at the Shanghai New International Exhibition Center on June 29th through July 1st.
About Qualcomm Incorporated
Qualcomm Incorporated (NASDAQ: QCOM) is a world leader in 3G, 4G and next-generation wireless technologies. Qualcomm Incorporated includes Qualcomm’s licensing business, QTL, and the vast majority of its patent portfolio. Qualcomm Technologies, Inc., a subsidiary of Qualcomm Incorporated, operates, along with its subsidiaries, substantially all of Qualcomm’s engineering, research and development functions, and substantially all of its products and services businesses, including its semiconductor business, QCT. For more than 30 years, Qualcomm ideas and inventions have driven the evolution of digital communications, linking people everywhere more closely to information, entertainment and each other. For more information, visit Qualcomm’s website, OnQ blog, Twitter and Facebook pages.
Except for the historical information contained herein, this news release contains forward-looking statements that are subject to risks and uncertainties, as well as the other risks detailed from time to time in the Company’s SEC reports, including the report on Form 10-K for the year ended September 30, 2013, and most recent Form 10-Q. The Company undertakes no obligation to update, or continue to provide information with respect to, any forward-looking statement or risk factor, whether as a result of new information, future events or otherwise.
Qualcomm Snapdragon, Qualcomm VIVE and MDM are products of Qualcomm Technologies, Inc.
Qualcomm, VIVE and Snapdragon are trademarks of Qualcomm Incorporated, registered in the United States and other countries.
Pete Lancia, Corporate Communications
Warren Kneeshaw, Investor Relations
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SOURCE Qualcomm Incorporated